David,
The key question here, why is the "factory guy" telling you what he is
telling you? I think there may be some confusion about his comments. You
are
interpretting it that the copper polygon should be solid (not drawn from
individual lines) but I would bet he is calling for a solid ground plane
within the board (a multilayer board design). What you have described
about
your design is quite normal for a lot of designs, designs use a poured
polygon GND flooded over the unused areas of the design quite often. And
the
multitude of individual lines making up that polygon pour is quite normal
also.
But why is the factory telling you what to do? Just fi****ng here
because
the relation****p sounds a little funny the way that you have stated it in
such limited detail.
Do your GND connections make connections to all GND points without
breaks? Do your OrCAD DRC checks re****t any incomplete routes/connections?
Do you have any controlled impedance lines called out? That could be a
problem causing such a request from the factory guy. You can't have
controlled impedance without a contiguous associated plane directly below
or
above your trace. If you have controlled impedance in this design then you
obviously don't understand the requirements for impedance controlled lines
and the factory guy knows you need a contiguous internal plane to achieve
the impedance control for those lines.
--
Sincerely,
Brad Velander.
"David" <dgvalde@[EMAIL PROTECTED]
> wrote in message
news:cd2faf90-a1ab-4e06-8ad2-905ac91c3d81@[EMAIL PROTECTED]
> Hi everyone!
>
> I'm having problems with Orcad Layout. I've desgned a PCB for my
> company and I've sent the GERBER files to the factory. But the factory
> operator said me that the ground planes I've created on my design
> aren't solid planes and they must be solid planes.
>
> My idea was to use all the unused PCB surface to make the ground
> tracks bigger, so they take all the space available where there are
> any tracks. Therefore I've place a big copper pour obstacle associated
> to the ground net. The result seems to be really good, I mean I can
> see a lot of copper areas going around the tracks.
>
> But the factory guy said that, actually, the copper obstacles are made
> of thousands of little tracks (about 75000 tracks!!). So they just see
> a lot of tracks instead of a real copper area despite it seems a
> homogeneous area. But this is a problem for the PCB's machine.
>
> Somehow I needto tell Orcad that the copper pour must be a continuous
> and homogeneous area.
>
> Could you help me? I need to work out with this problem now!
>
> Regards
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