Dear All
Currently I read about systematic yield and random yield effect on the
overall yield of wafer.
I have no idea how people actually group the systematic yield and
random yield separately.
Do people get the overall yield from probing and then run
statistically tool and analysis to get the
systematic and random yield by some advanced curve fitting techniques?
OR some matrix of different conditions need to be run in order to find
the systematic part of the sensitivity in yield loss?
I believe the first one should be more advisable.
Kindly enlighten.
Thank you for your help in advance.
best regards
Jason
