A while back I read a post (shown below), regarding a high speed
demoisturizing process that can supposedly bake-out in integrated
circuits in 24 hours.
I was impressed, but forgot all about it until I found something...
There is a website that discusses, what seems to be, an identical
process.
http://innovativedryingco.com
I'm watching a presentation on the 24 hour bake-out process, now,
and... WAIT. It is the our very own "Stu" Leech!
Everyone, have a look at the website and tell me what you think. This
guy is about to make dealing with Moisture Sensitive Devices (MSDs)
cake, if his proof of process is proof indeed.
Presentations and whitepapers on the subject may be found, here:
http://innovativedryingco.com/media.htm
Cheers!
J
On Jun 1 1999, 12:00 am, sleech6...@[EMAIL PROTECTED]
wrote:
> Demoisturizing or "Dry-Packing" plastic packages is a slow, expensive
> process that adds no value to your product. Worse, it slows your product
> in the "race from the die to the dock."
>
> A new process has been proven its ability to cut your demoisturizing
> times by 50%. One user with four of these systems re****ts a 48% increase
> in solderabilty yield. No surprises here, many hours at temperature =
> much oxide formation, ... few hours at temperature = fewer oxides
> formed.
>
> Recently one user of the new TVP process discovered a few useful facts
> about "dry-pack" process in general.
>
> 1) The 24 hour, 125 Deg. C bake-out that both EIA/JESD22B-A113B and
> IPC/JEDEC J-STD-033 assume dry the package...DOES NOT COMPLETELY DRY THE
> PACKAGE.
>
> 2) By establi****ng the adsorption and desorption curves for a
> particular package, per EIA/IPC J-STD-120, Section 10, will give you
> curves that you can use to successfully vary the amount of actual TVP
> processing time you will need to remove the "floormoisturelevel" from
> your devices prior to barrier-bagging.
>
> 3) The molding compound used to encapsulate adevice, the die pad area,
> thickness of the package and lead count are extremely im****tant in
> protecting your packages from delamination and fractures at assembly
> reflow. Take the pop out of "popcorning" failures.
>
> 4) With the molding compound being the only variable. You can have up to
> a 100% difference in your "bake-out" or TVP cycle time.
>
> If you are as sick and tired of fighting "dry-pack" issues and concerns
> as I am, and want to learn a little more about the ways to "put them to
> bed." Post here or email me direct at sle...@[EMAIL PROTECTED]
>
> Charles "Stu" Leech Jr.
>
> P.S. If you are going to be in San Jose January 13th, I and David L.
> Smith of Level One Communications are presenting two papers on the
> subject.
>
> Sent via Deja.comhttp://www.deja.com/
> Share what you know. Learn what you don't.
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